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Embedded Processors XCVM1802-1MSIVFVC1760 Tray

Product Details:
Place of Origin: USA
Brand Name: Xilinx Inc
Model Number: XCVM1802-1MSIVFVC1760
Payment & Shipping Terms:
Minimum Order Quantity: 50PCS
Price: RFQ
Packaging Details: ESD/Vacuum/Foam/Cartons
Delivery Time: Immediately
Payment Terms: T/T, Western Union, escrow, Paypal, Visa, MoneyGram
Supply Ability: RFQ
Specifications Product Description Request A Quote
Specifications
Specifications
Package / Case :: 1760-BFBGA, FCBGA
Product Category :: Systems On A Chip - SoC
Primary Attributes :: Versal™ Prime FPGA, 1.9M Logic Cells
Speed :: 600MHz, 1.3GHz
Supplier Device Package :: 1760-FCBGA (40x40)
Flash Size :: -
RAM Size :: 256kB
Connectivity :: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature :: -40°C ~ 100°C (TJ)
Package :: Tray
Architecture :: MPU, FPGA
Core Processor :: Dual ARM® Cortex®-A72 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5F With CoreSight™
Product Status :: Active
Peripherals :: DDR, DMA, PCIe
Series :: Versal™ Prime
Manufacturer :: Xilinx Inc
Product Description
The XCVM1802-1MSIVFVC1760,from Xilinx Inc,is Systems on a Chip - SoC.what we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please contact us through the “online chat” or send a quote to us!
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Contact Person : Mr. Jack
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